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ZhongFeng Electronic Technology Co., Limited

ZhongFeng Electronic Technology Co., Limited

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86-0755-23218920

ZhongFeng Electronic Technology Co., Limited
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    Box Build Final Printed Circuit Board PCB Assembly
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    Prototype PCB Printed Circuit Board for Power Bank
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    94v0 FR4 pcb board bluetooth speaker pcb
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    Big Volume Electronic PCB Fabrication and PCB Assembly
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    Surface Mount Technology Assembly PCB Assembly
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    Customized OEM Electronic PCB Assembly PCBA Prototype
  • Customized Printed Circuit Board Assembly SMT PCBA
    Customized Printed Circuit Board Assembly SMT PCBA
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    Big Volume Printed Circuit Boards PCB PCBA Assembly

ABOUT US

15years in providing PCB Fab, PCB Assembly, components sourcing and One-Stop EMS service (electronics manufacturing services). Since established in 2003, we have helped thousands of engineers, purchasers and electronic hobbyists developed and manufactured their innovative products in consumer electronics, medical equiment, IOT, industrial control, automotive electronics, communications equipment and other high-tech fields. PCB manufacture compliant ISO9001, ISO14001, TS16949 and UL. PCB assembly compliant ISO9001, IATF16949, PDCA and IPC-A-610E. And all components are original. Our clients include big companies like CTS, FEV, Delta and Premo, and also many scientific research institution, small companies and individuals.
  • 24
    24 H Online Service No Time Difference.
  • 2003
    It is a Chinese brand established in 2003.
  • 100
    Our Factory Have More Than 100 Employees.
  • 3000
    More Than 3000 Square Meters Technical R&D Building.
News
  • Whether or not the PCB ink quality is excellent is in principle impossible to separate from the combination of the above major components. The excellent ink quality is a comprehensive manifestation of the formula's scientificity, advanced nature and environmental protection. It is reflected in: Viscosity is short for dynamic viscosity. Viscosity is generally expressed as the shear stress of the fluid flow divided by the velocity gradient in the flow layer direction, and the international unit is Pa/s (Pa.s) or milli-Pascal/sec. (mPa.S). In PCB production, the fluidity of the ink is driven by external forces. Conversion of viscosity units: 1Pa. S=10P=1000mPa. S=1000CP=10dpa. s Plasticity refers to the nature of the ink before it is deformed after the ink is deformed by external forces. The plasticity of the ink helps to improve the printing accuracy; Thixotropic inks are colloidal when they are left standing, and they are also known as thixotropy and sag resistance when they are exposed to changes in viscosity. The degree of fluidity (leveling) ink spreading to the surroundings under external force. Fluidity is the reciprocal of the viscosity, which is related to the plasticity and thixotropy of the ink. Plasticity and thixotropy are large, and fluidity is large; when the fluidity is large, the imprinting is easy to expand. Small liquidity, prone to netting, resulting in ink phenomenon, also known as reticulate; Viscoelasticity refers to the property that the ink is quickly rebounded by shearing the broken ink after the squeegee is scratched. It is required that the ink be deformed quickly, and ink rebounding can be used to facilitate printing. Dryness requires the ink to dry on the screen slower the better, and hope that the ink is transferred to the substrate, the faster the better; Fineness of pigment and solid material par
    2019-06 27
  • With the rapid development of electronic technology and the ever-shortening lifecycle of electronic products, higher and higher requirements have been put forward for PCB board assembly manufacturers. At the same time, global market competition has caused companies to face increasing international pressure. In order to survive and develop in the ever-changing market competition, modern PCB board assembly and manufacturing companies must adopt advanced production models to respond quickly to customer orders and provide high-quality, low-priced products. System integration and information integration (CIMS) are important technologies for improving enterprise management efficiency. Many companies have improved their level of production management and market competitiveness by continuously improving the automation of the placement line and introducing advanced enterprise-level management information systems (such as MRPII, ERP, etc.). However, general MRPII/ERP only manages enterprise-level resource plans. It can usually only process historical or forecast data, and cannot timely and accurately reflect the equipment status and production data of the current production site. At the same time, the on-site production equipment control system cannot transfer real-time production data to the upper-level resource management system. As a result, the enterprise resource planning layer lacks effective real-time information support for equipment, and the control link cannot be effectively optimized for scheduling and coordination [1]. Therefore, how to effectively combine the advanced production line control system with the enterprise-level production management information system and build a bridge between them to provide information communication is an urgent problem to be solved in the enterprise information construction. The Manufacturing Execution System (MES) solves this problem. The manufacturing execution system is a workshop-oriented management information system located
    2019-06 27
  • This article explains the difference between PCB positive and negative, PCB positive negative output, manufacturing process difference and difference, and PCB negative use, what are the benefits, etc., you can find the answer here. PCB Negative Output Process What is the difference between PCB positive and negative film----The difference between PCB positive and negative: PCB positives and negatives are the opposite of the manufacturing process. The effect of the PCB positive film: wherever the line is drawn, the copper of the printed board is retained, and the place where no line is drawn is removed. The signal layer such as the top layer and the bottom layer is the positive film. The effect of the PCB negative film: Wherever the line is drawn, the copper of the printed board is removed, and the place where no line is drawn is preserved. Internal Planes layer (internal power/ground layer) (internal power layer) for arranging power and ground. The traces or other objects placed on these levels are copper-free areas, ie the working layer is negative. PCB Negative Output Process What is the difference between PCB positive and negative film----What is the difference between PCB positive and negative output? PCB negative output print Negative film: Generally speaking, we are talking about the tenTIng process, and the liquid used is acid etching. Negative film is because after the film is made, the desired line or copper surface is transparent, and the unnecessary part is black or brown. After exposure by the line process, the transparent part is chemically affected by the light of the dry film resist. Hardening, the subsequent development process will wash away the dry film without hardening, so only the dry film is etched away in the etching process to wash away part of the copper foil (the black or brown part of the film), while leaving the dry film is not W
    2019-06 25