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Features
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Capabilities
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Layers
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1-36 layers
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Material
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FR-4 (Standard FR4, Mid-Tg FR4, Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Metal Core, Polyester, etc.
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Board Thickness
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0.2mm-6.0mm (.016"-.126")
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Copper Thickness
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1/2oz-6oz(18um-210um)
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Board size
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600mm*1200mm
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Min Tracing/Spacing
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0.075mm/0.075mm (3mil/3mil)
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Min Annular Ring
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0.075mm (3mil)
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Min drilling Hole diameter
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0.15mm(6mil), 0.1mm(4mil)-laser drill
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Min width of cutout (NPTH)
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0.8mm
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Min width of slot hole (PTH)
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0.6mm
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Solder Mask
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LPI, different colors(Green, Green matt, Black, Black Matt, White, Red, Yellow, Blue)
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Silkscreen color
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White, Blue, Black, Red, Yellow
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Surface finish
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Lead free HASL, immersion gold, golden finger, immersion tin, immersion silver, OSP, Carbon oil, plated hard gold(up to 100u")
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Board thickness tolerance
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±10%
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Board size tolerance
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±0.1mm
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PTH hole size tolerance
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+/-.003"(+/-0.08mm)~+/-.006"(+/-0.15mm)
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NPTH hole size tolerance
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+/-.002"(+/-0.05mm)
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Impedance tolerance
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+/-5%~+/-10%
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Chamfer of Gold Fingers
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20, 30, 45, 60
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Test
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10V-250V, flying probe or testing fixture
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Others Techniques
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Gold fingers
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Blind/Buried hole
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peelable solder mask
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Edge plating
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Carbon Mask
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Kapton tape
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Countersink/counterbore hole
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Half-cutted/Castellated hole
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Press fit hole
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Via tented/covered with resin
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Via plugged/filled with resin
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Via in pad
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Ms. Thea