Company Details

  • ZhongFeng Electronic Technology Co., Limited

  •  [Guangdong,China]
  • Business Type:Manufacturer
  • Main Mark: Americas , Asia , Europe , North Europe , Oceania , West Europe , Worldwide
  • Exporter:71% - 80%
  • Certs:ISO/TS16949, ISO9001
  • Description:HDI BGA PCB,HDI PCB Prototype,BGA PCB Prototype
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ZhongFeng Electronic Technology Co., Limited

HDI BGA PCB,HDI PCB Prototype,BGA PCB Prototype

Home > Products > PCB > BGA PCB > 8Layer HDI BGA PCB Circuit Board Prototype

8Layer HDI BGA PCB Circuit Board Prototype

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    Payment Type: T/T,Paypal,Money Gram,Western Union
    Incoterm: FOB,CFR,CIF
    Min. Order: 1 Piece/Pieces
    Delivery Time: 5 Days

Basic Info

Model No.: ZFA0014

PCB: BGA

Surface Finished: ENIG

Silkscreen: White

Solder Mask: Green

Additional Info

Packaging:  EPE, Silica gel, bubble film, normal packing.

Productivity: 500,000pcs per Month

Brand: ZhongFeng

Transportation: Ocean,Land,Air,DHL

Place of Origin: Shenzhen China

Supply Ability: 500,000pcs per Month

Certificate: ISO9001, IATF16949, IPC-A-610F

HS Code: 8517709000

Port: Shenzhen,HongKong

Product Description

8Layer HDI BGA PCB Circuit Board Prototype


With advances in High density integration technology, and improvements in equipment, and the use of deep submicron technology, LSI, VLSI, and ULSI have emerged one after another. The degree of integration of silicon monolithic chips has continued to increase, and the requirements for integrated circuit packaging have become stricter, and the number of I/O pins has increased. Rapid increase in power consumption also increases. In order to meet the needs of development, on the basis of the original package type, a new type of ball grid array package, abbreviated as BGA (Ball Grid Array Package), has been added.


Design engineers would face many issues when designing BGA PCB circuit board for electronic products. The bottleneck of layout and layout design, whether the design process can be matched with the processing enterprise, whether the design of the BGA pad is likely to lead to the occurrence of cold soldering or short-circuit, and whether the design planning leads to Increase in costs and so on.


PCB Assembly-2


Our Services:

1. PCB Design: One-stop EMS manufacturer, speciallized in designing wireless charging PCBA, bluetooth earphone & Voice box PCBA and other consumer electronics products.

2. PCB Manufacture: Standard FR4 1-36layer PCB, Flex PCB, Rigid-Flex PCB, HDI PCB, Rogers PCB, Metal Core PCB, etc.

3. PCB Assembly: SMT and THT assembly, available for 01005, fine pitch and BGA assembly.

4. Components Sourcing: Available to source all components shown in BOM file (BOM Kitting), hard to find components and long lead time components, etc.

5. One-Stop Turnkey PCBA Manufacture: PCB design+PCB Manufacture+Components Sourcing+PCB Assembly+Electronic Assembly, or PCB Manufacture+Components sourcing+PCB Assembly, etc.


Technical Capabilities:


PCB Manufacture Capabilities

Layers

1-36 layers

Material

FR-4 (Standard FR4, Mid-Tg FR4, Hi-Tg FR4, Lead free assembly material) , Polymide, Metal Core, Rogers, etc.

Board Thickness

0.1mm-6.0mm (.016"-.126")

Copper Thickness

1/2oz-6oz(18um-210um)

Board size

600mm*1200mm

Min Tracing/Spacing

0.075mm/0.075mm (3mil/3mil)

Min drilling Hole diameter

0.15mm(6mil), 0.1mm(4mil)-laser drill

Solder Mask

LPI, different colors(Green, Green matt, Black, Black Matt, White, Red, Yellow, Blue)

Silkscreen color

White, Blue, Black, Red, Yellow

Surface finish

Lead free HASL, immersion gold, golden finger, immersion tin, immersion silver, OSP, Carbon oil, plated hard gold(up to 100u")

Impedance tolerance

+/-5%~+/-10%

Chamfer of Gold Fingers

20, 30, 45, 60

Test

Flying probe or Testing fixture

PCB Assembly Capabilities

Quantity

From prototype to big volume, no MOQ

Assembly type

SMT, THT or Hybrid

Parts procurement

Full turnkey (we provided all components)

Partial turnkey ( Customer provide the main components and we provide the rest)

Kitted (Customer provide all components)

Component types

SMT 01005, BGA 0.3mm pitch, QFP 0.3mm pitch, etc.

Test

Custom testing, ICT, FCT, AOI, Test jig

Our Team and Office:


Zhongfeng Smt Factory


Our PCB Manufacture Factory:

Pcb Assembly

Our PCB Assembly Factory:

Turnkey Pcb Assembly


FAQ:

Q: What files need for custom PCB manufacture?

A: Gerber or .pcb or .pcbdoc or .brd file is required.

Q: What files need for Custom PCB Assembly order?

A: Gerber and the BOM files are required, if you have pick&place file, send it to us as well.

Q: What is payment terms acceptable?

A: For new customer and the total amount within 10000usd, 100% payment in advance by PayPal or T/T or WU. For total amount beyond 10000usd, please contact us.

Q: What files need for PCB/PCBA clone services?

A: For PCB/PCBA clone service, send us the pictures for evaluate first, and we will need 1-2 samples of the PCB/PCBA board for copying.

Looking for ideal HDI BGA PCB Manufacturer & supplier ? We have a wide selection at great prices to help you get creative. All the HDI PCB Prototype are quality guaranteed. We are China Origin Factory of BGA PCB Prototype. If you have any question, please feel free to contact us.

Product Categories : PCB > BGA PCB

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